DELL PERU S.A.C EN LA PARTIDA POLÍMEROS, POLIACETALES, POLIAMIDAS, RESINAS AMÍNICAS, SILICONAS. RESINAS DE PETRÓLEO, CELULOSA, DESECHOS DE PLÁSTICO, MONOFILAMENTOS DE PLÁSTICO, TUBOS, LÁMINAS, IMPLEMENTOS Y REVESTIMIENTOS DE PLÁSTICO: 269 TOTAL REGISTROS
| ADUANA | AÑO DUA | CANT. | UNIDAD MEDIDA | PRODUCTO | ORIGEN | PROCEDENCIA | VALOR FOB $ |
|---|---|---|---|---|---|---|---|
| AEREA Y POSTAL EX-IAAC | 2025 | 0.101 | KG | ALMOHADILLA TERMICA, FOXCONN, S/M ALMOHADILLA TERMICA P/N: VVVJN | CHINA | UNITED STATES | 14.38 |
| AEREA Y POSTAL EX-IAAC | 2025 | 0.008 | KG | PELICULA DE PLASTICO, S/M, S/M PARTES PARA COMPUTADORA P/N: VM0F7 | UNITED STATES | UNITED STATES | 1.3 |
| AEREA Y POSTAL EX-IAAC | 2025 | 0.23 | KG | SILICONA TERMICA, S/M, S/M THERMAL SILICON P/N: 2TWJD | CHINA | UNITED STATES | 32.29 |
| AEREA Y POSTAL EX-IAAC | 2025 | 0.062 | KG | SILICONA TERMICA, S/M, S/M THERMAL SILICON P/N: JV1XG PARTES PARA COMPUTADORA | CHINA | UNITED STATES | 10.76 |
| AEREA Y POSTAL EX-IAAC | 2025 | 0.045 | KG | SILICONA TERMICA, S/M, S/M THERMAL SILICON P/N: JV1XG PARTES PARA COMPUTADORA CREDITO 90 DIAS - 07.11.2025 - 04.02.2026 | CHINA | UNITED STATES | 10.76 |
| AEREA Y POSTAL EX-IAAC | 2025 | 0.133 | KG | SILICONA TERMICA, S/M, S/M THERMAL SILICON P/N: 04P21 PARA COMPUTADORAS | CHINA | UNITED STATES | 11.5 |
| AEREA Y POSTAL EX-IAAC | 2025 | 0.313 | KG | SILICONA TERMICA, S/M, S/M SILICONA TERMICA P/N: JPMH5 PARA COMPUTADORA | CHINA | UNITED STATES | 40.96 |
| AEREA Y POSTAL EX-IAAC | 2025 | 1.746 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: RMGFY PARTES PARA COMPUTADORA | UNITED STATES | UNITED STATES | 245 |
| AEREA Y POSTAL EX-IAAC | 2025 | 1.005 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: RMGFY PARTES PARA COMPUTADORA | UNITED STATES | UNITED STATES | 232.75 |
| AEREA Y POSTAL EX-IAAC | 2025 | 0.159 | KG | SILICONA TERMICA, S/M, S/M THERMAL SILICON P/N: 2TWJD | UNITED STATES | UNITED STATES | 32.29 |
| AEREA Y POSTAL EX-IAAC | 2025 | 1.802 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: RMGFY PARTES PARA COMPUTADORA | UNITED STATES | UNITED STATES | 245 |
| AEREA Y POSTAL EX-IAAC | 2025 | 0.957 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: RMGFY PARTES PARA COMPUTADORA | UNITED STATES | UNITED STATES | 183.75 |