DELL PERU S.A.C EN LA PARTIDA POLÍMEROS, POLIACETALES, POLIAMIDAS, RESINAS AMÍNICAS, SILICONAS. RESINAS DE PETRÓLEO, CELULOSA, DESECHOS DE PLÁSTICO, MONOFILAMENTOS DE PLÁSTICO, TUBOS, LÁMINAS, IMPLEMENTOS Y REVESTIMIENTOS DE PLÁSTICO: 269 TOTAL REGISTROS
| ADUANA | AÑO DUA | CANT. | UNIDAD MEDIDA | PRODUCTO | ORIGEN | PROCEDENCIA | VALOR FOB $ |
|---|---|---|---|---|---|---|---|
| AEREA Y POSTAL EX-IAAC | 2024 | 0.026 | KG | ALMOHADILLA TERMICA, S/M, S/M ALMOHADILLA TERMICA P/N: 3CR06 | UNITED STATES | UNITED STATES | 2.68 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.051 | KG | ALMOHADILLA TERMICA, CHENTRONICS CHEMPAC, S/M ALMOHADILLA TERMICA P/N: 3CR06 | UNITED STATES | UNITED STATES | 5.36 |
| AEREA Y POSTAL EX-IAAC | 2024 | 3.893 | KG | CINTA AISLANTE, CHEMTRONICS CHEMPAD, S/M THERMAL PAD P/N: 0PYG4 CON JERINGA | UNITED STATES | UNITED STATES | 551.1 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.471 | KG | SILICONA TERMICA, DELL, S/M THERMAL SILICON P/N: RMGFY | CHINA | UNITED STATES | 98 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.547 | KG | SILICONA TERMICA, DELL, S/M SILICONA TERMICA P/N: 3CFW7 | CHINA | UNITED STATES | 44.9 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.184 | KG | SILICONA TERMICA, DELL, S/M SILICONA TERMICA P/N: MN2WR | CHINA | UNITED STATES | 15.08 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.067 | KG | SILICONA TERMICA, CHEMTRONICS CHEMPAD, S/M SILICONA TERMICA P/N: NF7RH PARTES DE COMPUTADORA | CHINA | UNITED STATES | 5.06 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.759 | KG | SILICONA TERMICA, DELL, S/M THERMAL SILICON P/N: RMGFY | CHINA | UNITED STATES | 110.25 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.202 | KG | SILICONA TERMICA, CHEMTRONICS CHEMPAD, S/M THERMAL SILICON P/N: RMGFY PAGO AL CREDITO 30 DIAS | UNITED STATES | UNITED STATES | 61.25 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.634 | KG | SILICONA TERMICA, ZZZSHINETSU, S/M THERMAL SILICON P/N: RMGFY | UNITED STATES | UNITED STATES | 110.25 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.588 | KG | SILICONA TERMICA, DELL, S/M THERMAL SILICON P/N: RMGFY | UNITED STATES | UNITED STATES | 85.75 |
| AEREA Y POSTAL EX-IAAC | 2024 | 0.684 | KG | SILICONA TERMICA, SHIN ETSU COMPANIES, S/M THERMAL SILICON P/N: RMGFY | UNITED STATES | UNITED STATES | 98 |