DELL PERU S.A.C EN LA PARTIDA POLÍMEROS, POLIACETALES, POLIAMIDAS, RESINAS AMÍNICAS, SILICONAS. RESINAS DE PETRÓLEO, CELULOSA, DESECHOS DE PLÁSTICO, MONOFILAMENTOS DE PLÁSTICO, TUBOS, LÁMINAS, IMPLEMENTOS Y REVESTIMIENTOS DE PLÁSTICO: 269 TOTAL REGISTROS
| ADUANA | AÑO DUA | CANT. | UNIDAD MEDIDA | PRODUCTO | ORIGEN | PROCEDENCIA | VALOR FOB $ |
|---|---|---|---|---|---|---|---|
| AEREA Y POSTAL EX-IAAC | 2023 | 0.029 | KG | SILICONA TERMICA, SHIN ETSU COMPANIES, S/M THERMAL SILICON P/N: 4RHVD | CHINA | UNITED STATES | 11.19 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.166 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: 0FV2G PARA COMPUTADORAS | CHINA | UNITED STATES | 32.29 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.029 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: PY6Y1 PARA COMPUTADORAS | CHINA | UNITED STATES | 10.72 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.093 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: PY6Y1 PARA COMPUTADORAS | CHINA | UNITED STATES | 21.44 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.093 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: PY6Y1 PARA COMPUTADORAS | CHINA | UNITED STATES | 21.44 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.03 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: D6H69 | CHINA | UNITED STATES | 11.23 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.24 | KG | SILICONA TERMICA, DELL, S/M THERMAL SILICON P/N: RMGFY | CHINA | UNITED STATES | 122.5 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.216 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: 6FJ63 | CHINA | UNITED STATES | 22.18 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.124 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: RMGFY | CHINA | UNITED STATES | 61.25 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.126 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: 820FC | CHINA | UNITED STATES | 32.15 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.167 | KG | SILICONA TERMICA, CHEMTRONICS, S/M THERMAL SILICON P/N: F95P0 PARTE DE COMPUTADORA | UNITED STATES | UNITED STATES | 32.28 |
| AEREA Y POSTAL EX-IAAC | 2023 | 0.058 | KG | SILICONA TERMICA, CHEMTRONICS CHEMPAD, S/M THERMAL SILICON P/N: D6H69 | UNITED STATES | UNITED STATES | 11.23 |